Title :
Simulation and optimization of interconnect delay and crosstalk in multi-chip modules
Author :
Nakhla, Michel ; Zhang, Qi-Jun
Author_Institution :
Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
Abstract :
As signal speeds increase, interconnect effects such as delay, distortion and crosstalk become the dominant factor limiting the overall performance of a multichip module. The authors outline efficient techniques recently developed for addressing three specific aspects of the high-speed interconnect problem, namely, simulation, sensitivity analysis and performance optimization. These techniques accommodate distributed interconnect models represented by lossy coupled transmission lines. Two examples showing the applications of these techniques are included
Keywords :
circuit analysis computing; crosstalk; hybrid integrated circuits; modules; sensitivity analysis; transmission lines; MCM; crosstalk; distortion; distributed interconnect models; high-speed interconnect problem; interconnect delay; interconnect effects; lossy coupled transmission lines; multi-chip modules; multichip module; performance optimization; sensitivity analysis; simulation; Analytical models; Couplings; Crosstalk; Delay effects; Distortion; Multichip modules; Optimization; Propagation losses; Sensitivity analysis; Transmission lines;
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
DOI :
10.1109/MCMC.1992.201446