Title :
On the study of skin-effect and dispersion of heavily lossy transmission lines
Author :
Pan, G. ; Zhu, X. ; Wang, B. ; Gilbert, B.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Wisconsin Univ., Milwaukee, WI, USA
Abstract :
A special case of a circular coaxial cable with heavy conduction loss was studied by full-wave analysis, and compared with the quasi-transverse electromagnetic (TEM) solutions. It was found that at high frequencies the tangential electrical fields will be much greater than the values reported in the literature. Despite relatively strong longitudinal E-fields and radial currents, the comparison revealed that, provided the circuit parameters are properly evaluated, the errors introduced by a simple distributed circuit model under the quasi-TEM assumption are not excessively large. Therefore, the telegraphist´s equations may give good results up to frequencies of 10 GHz or higher for transmission lines of small geometries commonly found in microelectronics packaging. A second case of three coupled microstrips of rectangular cross-section was also analyzed and compared with network measurements. It was found that the dispersion occurring in microelectronics packaging interconnects at frequencies up to the microwave band is anomalous
Keywords :
coaxial cables; coupled circuits; dispersion (wave); hybrid integrated circuits; skin effect; strip lines; transmission line theory; 0 to 10 GHz; MCM; circular coaxial cable; full-wave analysis; heavily lossy transmission lines; heavy conduction loss; high frequencies; longitudinal E-fields; microelectronics packaging; multichip modules; network measurements; quasi-TEM assumption; radial currents; rectangular cross-section; simple distributed circuit model; skin-effect; small geometries; tangential electrical fields; telegraphist´s equations; three coupled microstrips; Coaxial cables; Coupling circuits; Distributed parameter circuits; Electromagnetic analysis; Equations; Frequency; Geometry; Microelectronics; Microstrip; Packaging;
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
DOI :
10.1109/MCMC.1992.201447