DocumentCode
3052732
Title
Full wave electrical modeling of MCM by robust design methodology
Author
Iqbal, Asif
Author_Institution
IBM Corp., Hopewell Junction, NY, USA
fYear
1992
fDate
18-20 Mar 1992
Firstpage
83
Lastpage
85
Abstract
The author describes the modeling of a glass ceramic multichip module (MCM) by using statistical design techniques. The electrical design of the MCM was achieved by a robust design technique using a full-wave electromagnetic solver. The design point was determined by modeling a five-level fractional factorial matrix covering the full range of the process capabilities. The design point yielded a 50-Ω characteristic impedance and a near-end noise of <5% of the logic swing
Keywords
hybrid integrated circuits; modules; 50 ohm; MCM; characteristic impedance; electrical design; five-level fractional factorial matrix; full wave electrical modeling; full-wave electromagnetic solver; glass-ceramic modules; multichip modules; near-end noise; robust design methodology; statistical design techniques; Circuit noise; Design methodology; Electromagnetic modeling; Electromagnetic propagation; Impedance; Packaging; Propagation delay; Robustness; Signal design; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-2725-5
Type
conf
DOI
10.1109/MCMC.1992.201453
Filename
201453
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