• DocumentCode
    3052732
  • Title

    Full wave electrical modeling of MCM by robust design methodology

  • Author

    Iqbal, Asif

  • Author_Institution
    IBM Corp., Hopewell Junction, NY, USA
  • fYear
    1992
  • fDate
    18-20 Mar 1992
  • Firstpage
    83
  • Lastpage
    85
  • Abstract
    The author describes the modeling of a glass ceramic multichip module (MCM) by using statistical design techniques. The electrical design of the MCM was achieved by a robust design technique using a full-wave electromagnetic solver. The design point was determined by modeling a five-level fractional factorial matrix covering the full range of the process capabilities. The design point yielded a 50-Ω characteristic impedance and a near-end noise of <5% of the logic swing
  • Keywords
    hybrid integrated circuits; modules; 50 ohm; MCM; characteristic impedance; electrical design; five-level fractional factorial matrix; full wave electrical modeling; full-wave electromagnetic solver; glass-ceramic modules; multichip modules; near-end noise; robust design methodology; statistical design techniques; Circuit noise; Design methodology; Electromagnetic modeling; Electromagnetic propagation; Impedance; Packaging; Propagation delay; Robustness; Signal design; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-2725-5
  • Type

    conf

  • DOI
    10.1109/MCMC.1992.201453
  • Filename
    201453