• DocumentCode
    3052755
  • Title

    Innovation risks of hi-tech start-ups and the key factors to success

  • Author

    Lei, Jiasu ; Cao, Ning ; Zhu, Jiazhen ; Dai, Zhihui

  • Author_Institution
    Sch. of Econ. & Manage., Tsinghua Univ., Beijing, China
  • Volume
    1
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    390
  • Abstract
    This work focuses on the innovation risks that hi-tech start-ups face and the key factors that contribute to the success of these enterprises. Hi-tech start-ups are confronted with three types of risks: (1) technological risk, resulting from the explorative nature of R&D and production of hi-tech products; (2) market risk, as a result of the high uncertainty in the hi-tech product market; and (3) and financial risk. Hi-tech innovation usually requires huge investment. However, most hi-tech start-ups lack long-term investment capability. Accordingly, the authors find seven factors indispensable to a successful hi-tech start-up: enterprising leaders; core technology and root technology; people who have good command of these technologies; efficient incentive mechanism; project selection; backup of venture capital; and quick product entry into the market and solid technical service
  • Keywords
    investment; product development; research and development management; risk management; R&D; R&D management; core technology; enterprising leaders; financial risk; hi-tech product development; hi-tech start-ups; incentive mechanism; innovation risks; investment; key success factors; market risk; product market entry; project selection; root technology; technical service; technological risk; venture capital backup; Aerospace industry; Biological materials; Communication industry; Computer industry; Electronics industry; Investments; Manufacturing industries; Optical materials; Space technology; Technological innovation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Management of Innovation and Technology, 2000. ICMIT 2000. Proceedings of the 2000 IEEE International Conference on
  • Print_ISBN
    0-7803-6652-2
  • Type

    conf

  • DOI
    10.1109/ICMIT.2000.917369
  • Filename
    917369