Multichip module enables for high reliability applications

Author

Chu, D. ; Reber, C.A. ; Draper, B.L. ; Sweet, J.N. ; Palmer, D.W.

Author_Institution

Sandia Nat. Labs., Albuquerque, NM, USA

fYear

1992

fDate

18-20 Mar 1992

Firstpage

102

Lastpage

105

Abstract

To gain uniform, rigorous multichip module (MCM) qualification for high-reliability applications, Sandia has developed: a set of assembly test chips which are available for manufacturers and users to evaluate, characterize, and compare the particular MCM technology in terms of materials, chemical aging, geometries, stress state, thermal management, and assembly techniques; standard interconnect test structures as test coupons on the MCM substrate to determine the aging reliability through accelerated aging and lot quality through statistics; and exhaustive chip pretest methodology through prepackaging in a way compatible with today´s military IC packaging assembly lines. The MCM substrate test structures and packaging for chip pretest are discussed

Keywords

ageing; circuit reliability; hybrid integrated circuits; integrated circuit manufacture; integrated circuit testing; modules; packaging; production testing; quality control; MCM substrate test structures; MCM technology; Sandia; accelerated aging; aging reliability; assembly test chips; exhaustive chip pretest methodology; high reliability applications; lot quality; military IC packaging assembly lines; multichip module; prepackaging; standard interconnect test structures; statistics; test coupons; Aging; Assembly; Chemical technology; Integrated circuit testing; Materials testing; Military standards; Multichip modules; Qualifications; Thermal management; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-2725-5

Type

conf

DOI

10.1109/MCMC.1992.201458

Filename

201458