Title :
Effect of humidity cycling on reliability of overlaid high density interconnects
Author :
Shan, X. ; Agarwal, R.K. ; Pecht, M. ; Evans, John
Author_Institution :
Maryland Univ., College Park, MD, USA
Abstract :
The authors present a finite element simulation, performed to observe the stresses generated in a typical high-density interconnect structure as a result of swelling mismatches due to water absorption. They focus on stresses which could cause de-adhesion and microbuckling of dielectric films due to humidity cycling. Numerical analysis was used to examine the potential failure sites, modes, and failure mechanisms
Keywords :
circuit reliability; environmental degradation; failure analysis; finite element analysis; humidity; hybrid integrated circuits; integrated circuit technology; numerical analysis; packaging; simulation; swelling; HDI; MCM; de-adhesion; dielectric films; failure mechanisms; failure modes; failure sites; finite element simulation; high density interconnects; humidity cycling; microbuckling; multichip modules; overlaid interconnects; reliability; swelling mismatches; water absorption; Bonding; Compressive stress; Copper; Delamination; Dielectric constant; Dielectric substrates; Humidity; Metallization; Polyimides; Thermal stability;
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
DOI :
10.1109/MCMC.1992.201459
