Technological issues for micromachining of new passive THz-components based on deep-trench silicon etching

Author

Biber, S. ; Schür, J. ; Schmidt, L.P.

Author_Institution

Inst. for Microwave Technol., Erlangen-Nurnberg Univ., Erlangen, Germany

fYear

2004

fDate

27 Sept.-1 Oct. 2004

Firstpage

145

Lastpage

146

Abstract

We present a survey of the application of micromachining techniques for the fabrication of THz-components. Micro-machining of new THz- devices based on deep trench etching of silicon is discussed with respect to its capability to generate complex 3-dimensional geometries with high aspect ratios (ARs) and to meet the high mechanical requirements for THz-components. First results for the application of deep trench etching for the design of a branch-line coupler for 600 GHz is discussed. We emphasize the potential of silicon based microstructures for manufacturing new devices and focus on technological issues.

Keywords

elemental semiconductors; etching; isolation technology; micromachining; micromechanical devices; silicon; submillimetre wave couplers; waveguide couplers; 600 GHz; Si; branch line coupler; deep trench silicon etching; micromachining; passive THz components; silicon based microstructures; three dimensional geometry; Adhesives; Etching; Frequency; Geometry; Manufacturing; Micromachining; Microwave technology; Milling; Optical waveguides; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Infrared and Millimeter Waves, 2004 and 12th International Conference on Terahertz Electronics, 2004. Conference Digest of the 2004 Joint 29th International Conference on

Print_ISBN

0-7803-8490-3

Type

conf

DOI

10.1109/ICIMW.2004.1421995

Filename

1421995