Title :
31st International Conference on Electronics Manufacturing and Technology
Abstract :
The following topics are dealt with: advanced packaging; flip chip device; thermal analysis; solder joint modeling; mechanical analysis; reliability and quality; mechanical modeling; underfill material; MEMS; wirebond study and characterization; device process; interconnect/material; device test; molding material and process characterization.
Keywords :
electronics packaging; flip-chip devices; integrated circuit interconnections; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; lead bonding; micromechanical devices; moulding; MEMS; advanced packaging; device interconnect/material; device process; device quality; device reliability; device test; flip chip device; mechanical analysis; mechanical modeling; molding material; process characterization; solder joint modeling; thermal analysis; underfill material; wirebond characterization; wirebond study;
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2006.4456417
