Title :
Characteristics of thin-film devices for a stack-type MCM
Author :
Takahashi, Shuji ; Hayashi, Yoshihiro ; Kunio, Takemitsu ; Endo, Nobuhiro
Author_Institution :
NEC Corp., Kanagawa, Japan
Abstract :
A stack-type multichip module (MCM) or CUBIC (cumulative bonded IC) is proposed. The CUBIC is composed of thin-film device layers that are only a few micrometers thick stacked vertically and connected electrically. It has short chip-to-chip interconnections and a small module size. The characteristics of the thin-film devices are reported as a function of polished silicon layer thickness
Keywords :
hybrid integrated circuits; integrated circuit technology; modules; packaging; thin film circuits; CUBIC; MCM; cumulative bonded IC; multichip module; polished Si layer thickness; stack-type; thin-film devices; Electrodes; Integrated circuit interconnections; Integrated circuit noise; Isolation technology; Semiconductor thin films; Silicon; Stacking; Substrates; Thin film devices; Transmission lines;
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
DOI :
10.1109/MCMC.1992.201474
