Title :
High-performance MCM interconnection circuits and fluxoelectronics
Author :
Ghoshal, Uttam ; Van Duzer, T.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Abstract :
The authors describe the benefits of air-dielectric interconnections and fluxoelectronic interconnection circuits in high-performance multichip modules (MCMS). Not only do superconductors provide low-loss, dispersionless interconnection, but they also provide low-power, high-speed alternatives to conventional interconnection circuits. The low current levels in fluxoelectronic methods and low-voltage interconnection circuits and the freedom from dielectric considerations in air-dielectric interconnections may be important for developing MCMs using high-temperature superconductors
Keywords :
Josephson effect; integrated circuit technology; modules; packaging; superconducting junction devices; LV circuits; MCM interconnection circuits; air-dielectric interconnections; dispersionless interconnection; fluxoelectronics; high-speed; low-loss; low-power; low-voltage interconnection circuits; multichip modules; superconductors; Conducting materials; Conductors; Delay; Impedance; Integrated circuit interconnections; Magnetic circuits; Power dissipation; Power system interconnection; Superconducting materials; Superconductivity;
Conference_Titel :
Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-2725-5
DOI :
10.1109/MCMC.1992.201478