• DocumentCode
    3053223
  • Title

    High-performance MCM interconnection circuits and fluxoelectronics

  • Author

    Ghoshal, Uttam ; Van Duzer, T.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
  • fYear
    1992
  • fDate
    18-20 Mar 1992
  • Firstpage
    175
  • Lastpage
    178
  • Abstract
    The authors describe the benefits of air-dielectric interconnections and fluxoelectronic interconnection circuits in high-performance multichip modules (MCMS). Not only do superconductors provide low-loss, dispersionless interconnection, but they also provide low-power, high-speed alternatives to conventional interconnection circuits. The low current levels in fluxoelectronic methods and low-voltage interconnection circuits and the freedom from dielectric considerations in air-dielectric interconnections may be important for developing MCMs using high-temperature superconductors
  • Keywords
    Josephson effect; integrated circuit technology; modules; packaging; superconducting junction devices; LV circuits; MCM interconnection circuits; air-dielectric interconnections; dispersionless interconnection; fluxoelectronics; high-speed; low-loss; low-power; low-voltage interconnection circuits; multichip modules; superconductors; Conducting materials; Conductors; Delay; Impedance; Integrated circuit interconnections; Magnetic circuits; Power dissipation; Power system interconnection; Superconducting materials; Superconductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi-Chip Module Conference, 1992. MCMC-92, Proceedings 1992 IEEE
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-2725-5
  • Type

    conf

  • DOI
    10.1109/MCMC.1992.201478
  • Filename
    201478