Title :
The Development of a Low Cost Wafer Level Bumping Process
Author :
Whitmore, Mark ; Staddon, Michael ; Manessis, Dionysios
Author_Institution :
DEK Printing Machines Ltd., Weymouth
Abstract :
This paper details the development of hardware modifications for a standard stencil printer that subsequently permit the placement of solid solder spheres onto wafers and other substrates. The developed process provides a low cost method for the bumping of wafer-level packages. Test results for the bumping of both 6 and 8" wafers with spheres sizes as small as 250 microns and pitches down to 400 microns are presented.
Keywords :
soldering; wafer level packaging; hardware modifications; low cost wafer level bumping process; size 6 in; size 8 in; solid solder spheres; stencil printer; wafer-level packaging; Costs; Electronics packaging; Environmentally friendly manufacturing techniques; Packaging machines; Printers; Printing machinery; Solids; Standards development; Wafer scale integration; Whales;
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2006.4456428
