DocumentCode
3053314
Title
The Development of a Low Cost Wafer Level Bumping Process
Author
Whitmore, Mark ; Staddon, Michael ; Manessis, Dionysios
Author_Institution
DEK Printing Machines Ltd., Weymouth
fYear
2007
fDate
8-10 Nov. 2007
Firstpage
35
Lastpage
41
Abstract
This paper details the development of hardware modifications for a standard stencil printer that subsequently permit the placement of solid solder spheres onto wafers and other substrates. The developed process provides a low cost method for the bumping of wafer-level packages. Test results for the bumping of both 6 and 8" wafers with spheres sizes as small as 250 microns and pitches down to 400 microns are presented.
Keywords
soldering; wafer level packaging; hardware modifications; low cost wafer level bumping process; size 6 in; size 8 in; solid solder spheres; stencil printer; wafer-level packaging; Costs; Electronics packaging; Environmentally friendly manufacturing techniques; Packaging machines; Printers; Printing machinery; Solids; Standards development; Wafer scale integration; Whales;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location
Petaling Jaya
ISSN
1089-8190
Print_ISBN
978-1-4244-0730-9
Electronic_ISBN
1089-8190
Type
conf
DOI
10.1109/IEMT.2006.4456428
Filename
4456428
Link To Document