Advanced Design Techniques for Package Power delivery Solution

Power systems for modern technology are getting increasingly harder to design. Cost effective package power delivery solution is becoming more difficult to design. Lower voltage operation coupled with higher current and aggressive current transients (di/dt) of the processor mandate a need for low inductance package capacitors to meet the diminishing load-line targets across a broad frequency range and to maintain the voltage rail within acceptable noise budgets. Since the low inductance (IDC -inter-digitated) capacitors are much more expensive than the 2 terminal high inductance capacitors, finding a cost effective package power delivery solution is a major challenge. This paper discusses several design techniques and recommends guidelines in the selection of package capacitors for a cost effective power delivery solution.