• DocumentCode
    3053946
  • Title

    Discussions on the Failure Mode and Criterion of Passivation Cracks

  • Author

    Zhang, Xueren

  • Author_Institution
    STMicroelectron., Toa Payoh
  • fYear
    2007
  • fDate
    8-10 Nov. 2007
  • Firstpage
    248
  • Lastpage
    252
  • Abstract
    Passivation cracks are studied with experimental observation and finite element simulation. Corner cracks are first initiated, and then edge cracks are subsequently initiated along the edge from the corner to the center. The cracks show a good symmetric pattern over both symmetric axes. Simulation results show that the maximum Von Mises stress is located at die corner, which correlates to the first crack initiation from experimental observation, and the direction of first principal stress matches exactly with the cracking direction (principal stress direction is vertical to the crack surface). Failure criterion for the passivation crack is then discussed.
  • Keywords
    cracks; finite element analysis; integrated circuit packaging; Von Mises stress; corner cracks; cracking direction; die corner; edge cracks; failure criterion; failure mode; finite element simulation; passivation cracks; symmetric axes; symmetric pattern; Electronic packaging thermal management; Electronics packaging; Finite element methods; Integrated circuit packaging; Passivation; Plastics; Stress; Surface cracks; Temperature; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing and Technology, 31st International Conference on
  • Conference_Location
    Petaling Jaya
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-0730-9
  • Electronic_ISBN
    1089-8190
  • Type

    conf

  • DOI
    10.1109/IEMT.2006.4456461
  • Filename
    4456461