Title :
High Filled Epoxy Composites for Electronic Packaging Application
Author :
Teh, P.L. ; Mariatti, M. ; Akil, H.M. ; Seetharamu, K.N. ; Wagiman, A.N.R. ; Beh, K.S.
Author_Institution :
Univ. Sains Malaysia, Nibong Tebal
Abstract :
Increasing demands in the electronic packaging industries have led to the need for high-performance organic substrate material like epoxy composites. This paper investigates the effect of ethanol as diluent in epoxy composites containing 0 to 60 vol% of mineral silica. Flexural properties of epoxy composites were studied at room temperature. Thermal properties were studied using dilatomater, dynamic mechanical analyzer (DMA) and thermogravimetric analysis (TGA). In overall, the properties of the epoxy composites are depend on the filler loading and the addition of ethanol as diluent.
Keywords :
composite materials; electronics packaging; dynamic mechanical analyzer; electronic packaging application; filler loading; flexural properties; high filled epoxy composites; high-performance organic substrate material; mineral silica; thermal properties; thermogravimetric analysis; Composite materials; Electronic packaging thermal management; Electronics industry; Electronics packaging; Ethanol; Mechanical factors; Minerals; Organic materials; Silicon compounds; Temperature;
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2006.4456466
