High Filled Epoxy Composites for Electronic Packaging Application

Author

Teh, P.L. ; Mariatti, M. ; Akil, H.M. ; Seetharamu, K.N. ; Wagiman, A.N.R. ; Beh, K.S.

Author_Institution

Univ. Sains Malaysia, Nibong Tebal

fYear

2007

fDate

8-10 Nov. 2007

Firstpage

275

Lastpage

281

Abstract

Increasing demands in the electronic packaging industries have led to the need for high-performance organic substrate material like epoxy composites. This paper investigates the effect of ethanol as diluent in epoxy composites containing 0 to 60 vol% of mineral silica. Flexural properties of epoxy composites were studied at room temperature. Thermal properties were studied using dilatomater, dynamic mechanical analyzer (DMA) and thermogravimetric analysis (TGA). In overall, the properties of the epoxy composites are depend on the filler loading and the addition of ethanol as diluent.

Keywords

composite materials; electronics packaging; dynamic mechanical analyzer; electronic packaging application; filler loading; flexural properties; high filled epoxy composites; high-performance organic substrate material; mineral silica; thermal properties; thermogravimetric analysis; Composite materials; Electronic packaging thermal management; Electronics industry; Electronics packaging; Ethanol; Mechanical factors; Minerals; Organic materials; Silicon compounds; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing and Technology, 31st International Conference on

Conference_Location

Petaling Jaya

ISSN

1089-8190

Print_ISBN

978-1-4244-0730-9

Electronic_ISBN

1089-8190

Type

conf

DOI

10.1109/IEMT.2006.4456466

Filename

4456466