QFN Miniaturization: Challenges and Solutions

The quad flat no-lead (QFN) package has gained great semiconductors market due to its advantages in thermal and electrical performance. In the further package miniaturization, challenges happened in assembly die attach and wire bonding processes, affected by extremely small and slim package size. The miniature QFN package success relied on epoxy dispensing performance and wire bonding robustness, much stringent in comparing to normal QFN. With cost as boundary condition, the new optimization methodology has helped obtaining permanent solutions in manufacturing. Leading industry in producing highly reliable, robust and cost effective miniature taped QFN, called micro ultra-thin QFN.