Title :
Introduction to Fine Copper Wire Development
Author :
Pan, Q.H. ; Tan, HB ; Yang, W.P. ; Dai, X.Z. ; Anderson, Harold ; Quah, Jerry
Author_Institution :
Leshan-Phoenix Semicond. Co. Ltd., Leshan
Abstract :
The article presents the fine 20 um (0.8 mil diameter) copper wire bonding development using SOT package as the test vehicle. The project scope covered fine copper wire bonding process capability study; reliability tests and electrical characterization; Cu-AI intermetallic compound (IMC) characterization and large scale manufacturability evaluation.
Keywords :
aluminium alloys; copper alloys; lead bonding; CuAl; SOT package; copper wire bonding; electrical characterization; fine copper wire development; intermetallic compound characterization; size 20 mum; test vehicle; Bonding processes; Copper; Gold; Packaging; Response surface methodology; Rough surfaces; Surface roughness; Surface topography; Thermal conductivity; Wire;
Conference_Titel :
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location :
Petaling Jaya
Print_ISBN :
978-1-4244-0730-9
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2006.4456482
