DocumentCode
3054362
Title
Introduction to Fine Copper Wire Development
Author
Pan, Q.H. ; Tan, HB ; Yang, W.P. ; Dai, X.Z. ; Anderson, Harold ; Quah, Jerry
Author_Institution
Leshan-Phoenix Semicond. Co. Ltd., Leshan
fYear
2007
fDate
8-10 Nov. 2007
Firstpage
376
Lastpage
380
Abstract
The article presents the fine 20 um (0.8 mil diameter) copper wire bonding development using SOT package as the test vehicle. The project scope covered fine copper wire bonding process capability study; reliability tests and electrical characterization; Cu-AI intermetallic compound (IMC) characterization and large scale manufacturability evaluation.
Keywords
aluminium alloys; copper alloys; lead bonding; CuAl; SOT package; copper wire bonding; electrical characterization; fine copper wire development; intermetallic compound characterization; size 20 mum; test vehicle; Bonding processes; Copper; Gold; Packaging; Response surface methodology; Rough surfaces; Surface roughness; Surface topography; Thermal conductivity; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing and Technology, 31st International Conference on
Conference_Location
Petaling Jaya
ISSN
1089-8190
Print_ISBN
978-1-4244-0730-9
Electronic_ISBN
1089-8190
Type
conf
DOI
10.1109/IEMT.2006.4456482
Filename
4456482
Link To Document