DocumentCode
3054393
Title
Differential sensing strategy for dynamic thermal testing of ICs
Author
Altet, Josep ; Rubio, Antonio
Author_Institution
Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
fYear
1997
fDate
27 Apr-1 May 1997
Firstpage
434
Lastpage
439
Abstract
A new testing alternative based on thermal wave propagation is proposed. Some failures, when activated, produce an increase in local power dissipation at various points. A thermal wave is generated by this increase and can be used as a test observable. In this paper, both the thermal wave and the heat sources that appear for a set of faults are characterised and a built-in sensing strategy based on differential considerations is analysed
Keywords
integrated circuit testing; IC; built-in differential sensing; dynamic thermal testing; failure; fault; heat source; power dissipation; thermal wave propagation; CMOS logic circuits; Circuit faults; Circuit testing; Fault detection; Integrated circuit testing; Logic testing; Power dissipation; Space heating; Thermal conductivity; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium, 1997., 15th IEEE
Conference_Location
Monterey, CA
ISSN
1093-0167
Print_ISBN
0-8186-7810-0
Type
conf
DOI
10.1109/VTEST.1997.600328
Filename
600328
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