"Material, Package and Mold Design Technology Development for Miniature Packages"

As the semiconductor world moves towards miniaturization of every possible component; the package design rules and material needs are constantly being challenged. This is because, the package is getting weaker due to aggressive size reduction and smaller mold compound to package size ratio. A study is conducted on package design robustness with package footprint size of 1.0 mm x 0.80 mm and molded body size of 0.80 mm x 0.60 mm x 0.50 mm thick; lead pitch 0.35 mm. this is 1/4^th of the size of SOT-563. Three type of internal lead design were studied for package strength, better mold locking and having maximum mold compound around leads. This report discusses the effect of two mold gate location; one on package side and the other in-between leads, on package chip, gate remain and moldability. It also discusses the findings during package trim and singulation whereby the singulation punch to molded body distance is 0.100 mm. The report also share mold compound formulation DOE, studying the effects of filler quantity, coupling agent, filler size, filler type and resin type on moldability and package strength. Mold Compound and lead frame design is selected based on moldability and the package robustness at various processes. Miniature Package design rules has been established for lead frame design, mold design, trim design and compound selection.