Title :
The Search for Resilience Weak Spots in Automotive Mixed-Signal Circuits
Author :
Kerzérho, V. ; Kerkhoff, H.G. ; Bollen, G-J ; Xing, Y.
Author_Institution :
Testable Design & Test of Integrated Syst. Group (TDT), Univ. of Twente, Enschede, Netherlands
Abstract :
This paper presents the search for and resulting effects of resilience weak spots in a commercial Local Interconnect Network (LIN) transceiver. Industrial reliability simulations based on aging of devices have been used to locate these weak spots. The objective is to improve the resilience of the circuit during its design and validation phase after determination of the weak spots. In the case of our target chip, this complete cycle was successfully completed. Finally a new simulation principle is being proposed in order to automate the search for weak spots to speed-up and strengthen this search. It enables at an early design stage to take appropriate counter measures to improve resilience.
Keywords :
automotive electronics; integrated circuit interconnections; integrated circuit reliability; microprocessor chips; mixed analogue-digital integrated circuits; transceivers; automotive mixed-signal circuits; commercial local interconnect network transceiver; counter measures; device aging; industrial reliability; resilience weak spots; target chip; Aging; Equations; Integrated circuit reliability; Mathematical model; Resilience; Transistors; Design for Reliability; PBTI; analogue; automated generation; automotive; mixed-signal; reliability simulation; resilience;
Conference_Titel :
Mixed-Signals, Sensors and Systems Test Workshop (IMS3TW), 2011 IEEE 17th International
Conference_Location :
Santa Barbara, CA
Print_ISBN :
978-1-4577-1144-2
DOI :
10.1109/IMS3TW.2011.23
