A Study on Lead Free SnAgCu Solder System

Author

Jiun, Hoh Huey ; Leng, Eu Poh ; Ding, Min ; Ahmad, Ibrahim

Author_Institution

Freescale Semicond. (M) Sdn. Bhd., Petaling Jaya

fYear

2007

fDate

8-10 Nov. 2007

Firstpage

450

Lastpage

455

Abstract

This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and differential scanning calorimetry (DSC) respectively. Overall results indicates that Sn3.8AgO.7Cu having the most favorable results with highest shear strength, narrow melting peak and low surface oxidation. Further works done to understand in depth of the microstructure and elemental properties reveals that Sn3.8AgO.7Cu has dendritic microstructure with Ag-Sn plate and Cu-Ni-Sn IMC interface.

Keywords

copper alloys; differential scanning calorimetry; oxidation; shear strength; silver alloys; solders; tin alloys; SnAgCu; differential scanning calorimetry; lead free solder system; low surface oxidation; mechanical properties; shear strength; solder alloy; surface elemental properties; thermal properties; Copper; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Matrices; Mechanical factors; Microstructure; Oxidation; Semiconductor device manufacture; Temperature; Sn-Ag-Cu solder; intermetallic; melting behavior; shear strength;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing and Technology, 31st International Conference on

Conference_Location

Petaling Jaya

ISSN

1089-8190

Print_ISBN

978-1-4244-0730-9

Electronic_ISBN

1089-8190

Type

conf

DOI

10.1109/IEMT.2006.4456493

Filename

4456493