Design of Planar and 3-D Components using Photoimageable process

Author

Aftanasar, M.S. ; Ng, C.Y. ; Young, P.R. ; Robertson, I.D.

Author_Institution

Univ. Sains Malaysia, Pinang

fYear

2007

fDate

8-10 Nov. 2007

Firstpage

481

Lastpage

485

Abstract

For improved interconnection and 3D structure design, low cost manufacturing solution is possible using thick film photoimageable technology. This improved thick film processing technique made integration between planar circuit, 3D circuit and active components realizable on a single module, while reducing the cost and increasing component count. Further investigations are in development stage to design applications especially in satellite and telecommunication module.

Keywords

integrated circuit design; integrated circuit interconnections; microwave integrated circuits; thick films; 3D circuit; 3D components; 3D structure design; low cost manufacturing solution; planar circuit; satellite module; telecommunication module; thick film photoimageable technology; thick film processing technique; Coupling circuits; Dielectric measurements; Filters; Frequency; Integrated circuit interconnections; Manufacturing; Materials science and technology; Substrates; Thick film circuits; Thick films; Interconnection technologies; Thick Film Materials;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing and Technology, 31st International Conference on

Conference_Location

Petaling Jaya

ISSN

1089-8190

Print_ISBN

978-1-4244-0730-9

Electronic_ISBN

1089-8190

Type

conf

DOI

10.1109/IEMT.2006.4456498

Filename

4456498