Dry Self-Assembly & Gang bonding of micro-components from silicon carrier to substrate wafer

We have demonstrated parallel self-assembly process based on mechanical shape-matching between the protrusions of micro-components and the cavities on an 8" carrier wafer. With external agitation, 1 times 1 mm² micro-components fall into ~2000 receptor sites on the carrier wafer. The reproducibility of self-assembly is shown by an average assembly yield of 95.8plusmn2.1% within 10 min for 9 repeated trials. The assembled micro-components were then aligned and gang bonded to the substrate wafer. The yield for gang bonding is about 98%. SU-8 can be used alternatively to fabricate the protrusions on the micro-components instead of the usual silicon DRIE process. These micro-components with SU-8 protrusions can be self-assembled in a similar way as those micro-components with silicon protrusions.