DocumentCode
3054882
Title
Preface
fYear
2004
fDate
10-12 May 2004
Abstract
On behalf of the Organizing and Technical Committees, it is our pleasure to welcome you to the fifth international conference on ??Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems?? (EuroSimE2004) held at the Novotel Tour Noire, Brussels, Belgium, May 10 - 12, 2004.
Keywords
Analytical models; Components, Packaging, and Manufacturing Technology Society; Conference proceedings; Continents; Microelectronics; Organizing; Software tools; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Conference_Location
Brussels, Belgium
Print_ISBN
0-7803-8420-2
Type
conf
DOI
10.1109/ESIME.2004.1304007
Filename
1304007
Link To Document