Roadmap challenges - there is more than Moore [integrated system complexity growth]

In 1964, Fairchild engineer Gordon E. Moore postulated a bold theorem for exponential growth in the semiconductors industry. He stated ´The complexity for minimum component costs has increased at a rate of roughly a factor of two per year. Certainly over the short term this rate can be expected to continue, if not to increase. Over the longer term, the rate of increase is a bit more uncertain, although there is no reason to believe it will not remain nearly constant for at least 10 years. This paper deals with the challenges emanating from following the roadmap for microelectronics begun by Moore, with the emphasis on the consequences for the field of thermo mechanics. Which is a journey originating from and still very much influenced by the ever-increasing complexity of integrated silicon technologies, better known as system-on-chip. But also a journey into more and more diversified functions, electronic, mechanical and otherwise, integrated in a single product but not necessarily all on one chip, marking the outlines of the heterogeneous playground of system-in-package. While system-on-chip can be considered as more of Moore, system-in-package is really more than Moore. And for the latter, the future has only just begun.