Design and performance of UHF band inductors, capacitors and resonators using LTCC technology for mobile communication systems

Author

Eurskens, W. ; Wersing, W. ; Gohlke, S. ; Wannemnacher, V. ; Hild, P. ; Weigel, R.

Author_Institution

Corp. Technol., Siemens AG, Munich, Germany

Volume

3

fYear

1998

fDate

7-12 June 1998

Firstpage

1285

Abstract

We report on basic passive components integrated into ceramic substrate and on the performance of a finite element software package. The inductors of different types in a range of 1 nH to 10 nH show moderate dependence on frequency. Spurious resonances indicate coupling of neighboring structures. Shunt capacitors between 6 pF and 128 pF have resonances in contrast to the series capacitors depending on the ground plane. Stripline and lumped element resonators at 1 GHz showed Q factors around 100 and 50 respectively. Fair agreement of measurement and simulation was observed.

Keywords

Q-factor; UHF circuits; UHF devices; capacitors; ceramics; inductors; mobile communication; multichip modules; resonators; 1 GHz; 6 to 128 pF; LTCC technology; MCM; UHF band capacitors; UHF band inductors; UHF band resonators; ceramic substrate; finite element software package; lumped element resonators; mobile communication systems; passive components; series capacitors; shunt capacitors; stripline resonators; Capacitors; Ceramics; Finite element methods; Frequency; Inductors; Q factor; Resonance; Shunt (electrical); Software packages; Stripline;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1998 IEEE MTT-S International

Conference_Location

Baltimore, MD, USA

ISSN

0149-645X

Print_ISBN

0-7803-4471-5

Type

conf

DOI

10.1109/MWSYM.1998.700609

Filename

700609