DocumentCode
3055298
Title
Basal plane dislocation reduction in nitrogen doped 8° 4H-SiC epilayers
Author
Wheeler, V.D. ; VanMil, Brenda L. ; Myers-Ward, Rachael L. ; Eddy, Charles R. ; Stahlbush, R.E. ; Gaskill, D. Kurt
Author_Institution
U.S. Naval Res. Lab., Washington, DC, USA
fYear
2009
fDate
9-11 Dec. 2009
Firstpage
1
Lastpage
2
Abstract
In summary, this work has shown that the mechanism by which BPDs are converted to TEDs is dependent on carrier concentration and type in 8° off-cut SiC epilayers. The conversion process takes place throughout the epilayer for UID-p films, even when an interrupt is employed, while low nitrogen doped films exhibit an abrupt increase in conversion at interrupts. High levels of nitrogen doping in the film prior to the interrupt drastically reduce the conversion efficiency. Therefore, it is imperative to better understand the role of nitrogen on the BPD conversion process to achieve full annihilation of BPDs in an n+ buffer layer for reliable bipolar devices.
Keywords
chemical vapour deposition; semiconductor doping; semiconductor epitaxial layers; silicon compounds; wide band gap semiconductors; SiC; basal plane dislocation reduction; carrier concentration; nitrogen doped epilayers; Doping; Educational institutions; Etching; Image converters; Laboratories; Material properties; Nitrogen; Silicon carbide; Substrates; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Device Research Symposium, 2009. ISDRS '09. International
Conference_Location
College Park, MD
Print_ISBN
978-1-4244-6030-4
Electronic_ISBN
978-1-4244-6031-1
Type
conf
DOI
10.1109/ISDRS.2009.5378072
Filename
5378072
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