Finite element modelling of crack detection tests

Author

Ridout, Stephen ; Dusek, Milos ; Bailey, Chris ; Hunt, Chris

Author_Institution

Centre of Numerical Modelling & Process Anal., Greenwich Univ., London, UK

fYear

2004

fDate

2004

Firstpage

141

Lastpage

146

Abstract

Four non-destructive tests for determining the length of fatigue cracks within the solder joints of a 2512 surface mount resistor are investigated. The sensitivity of the tests is obtained using finite element analysis with some experimental validation. Three of the tests are mechanically based and one is thermally based. The mechanical tests all operate by applying different loads to the PCB and monitoring the strain response at the top of the resistor. The thermal test operates by applying a heat source underneath the PCB, and monitoring the temperature response at the top of the resistor. From the modelling work done, two of these tests have shown to be sensitive to cracks. Some experimental results are presented but further work is required to fully validate the simulation results.

Keywords

crack detection; finite element analysis; mechanical testing; printed circuit testing; resistors; sensitivity analysis; strain measurement; thermal stress cracking; 2512 surface mount resistor solder joints; PCB load testing; crack detection tests; crack sensitivity analysis; fatigue crack length determination; finite element analysis; four-point test; pull test; resistor strain response; resistor temperature response; thermal cycling; thermal testing; Capacitive sensors; Fatigue; Finite element methods; Monitoring; Nondestructive testing; Resistors; Soldering; Surface cracks; Temperature sensors; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on

Print_ISBN

0-7803-8420-2

Type

conf

DOI

10.1109/ESIME.2004.1304033

Filename

1304033