Design, fabrication and comparison of lead-free/eutectic solder joint reliability of flip chip package

Author

Peng, Chih-Tang ; Chiang, Kuo-Ning ; Ku, Terry ; Chang, Kenny

Author_Institution

Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan

fYear

2004

fDate

2004

Firstpage

149

Lastpage

156

Abstract

This investigation presents a detailed design procedure for a lead-free flip chip BGA package which includes solder bump profile prediction, FEM simulation, test vehicle design/fabrication and accelerated thermal cycle (ATC) testing to study the reliability issues of the flip chip packages. The solder joint reliability of a flip chip package depends on the solder materials and the solder geometry. Therefore, this study is divided into two main topics: one is the effect of solder joint material (eutectic 63Sn/37Pb solder and lead-free 96.5Sn/3.5Ag solder) on the solder joint reliability, and the other is the effect of the geometry on the Sn/Ag solder joint reliability. The trends of the ATC testing coincide with the FE analysis results, thus confirming that this analysis-fabrication procedure is feasible for the solder joint geometry and material design of a flip chip BGA package.

Keywords

ball grid arrays; finite element analysis; flip-chip devices; integrated circuit packaging; integrated circuit reliability; lead alloys; life testing; silver alloys; solders; thermal stresses; tin alloys; ATC; FEM simulation; SnAg; SnPb; accelerated thermal cycle testing; eutectic solder joint reliability; flip chip BGA package; lead-free solder joint reliability; solder bump profile prediction; solder geometry; solder joint materials; test vehicle design/fabrication; Environmentally friendly manufacturing techniques; Fabrication; Flip chip; Geometry; Joining materials; Lead; Materials reliability; Packaging; Soldering; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on

Print_ISBN

0-7803-8420-2

Type

conf

DOI

10.1109/ESIME.2004.1304034

Filename

1304034