Title :
Virtual qualification of moisture induced failures of advanced packages [IC packages]
Author :
van Gil, M.A.J. ; Van Drie, W.D. ; Zhang, G.Q. ; Bressers, H.J.L. ; van Silfhout, R.B.R. ; Fan, X.J. ; Janssen, J.H.J.
Author_Institution :
Philips Centre for Ind. Technol., Eindhoven, Netherlands
Abstract :
This paper presents a combined numerical and experimental methodology for predicting and preventing moisture induced failures in encapsulated packages. Prevention of such failures can enable efficient and optimal pre-selection of materials, their interfaces and geometric design with respect to the desired resistance to moisture. This virtual qualification methodology is illustrated for a specific BGA package which showed 50% failures (broken stitch-bonds) during HAST testing due to excessive warpage and/or delamination of different interfaces. For three different material combinations the moisture diffusion during the HAST test is predicted and subsequently thermo-mechanical-moisture simulations are performed where the effects of hygro-swelling, vapor pressure, thermal expansion and delamination on the failure mechanisms are predicted. The comparison of the simulation results of the different molding compounds with the observations of HAST testing indicates that the developed methods and models can predict the observed trends.
Keywords :
ball grid arrays; delamination; encapsulation; environmental degradation; finite element analysis; integrated circuit design; integrated circuit modelling; integrated circuit packaging; life testing; moisture; plastic packaging; swelling; thermal expansion; BGA package; HAST testing; IC package virtual qualification; broken stitch-bonds; delamination; encapsulated packages; failure mechanisms; finite element methodology; highly accelerated stress testing; hygro-swelling; materials preselection; moisture diffusion; moisture resistance; molding compounds; plastic encapsulated packages; thermal expansion; thermo-mechanical-moisture simulations; vapor pressure; warpage; Delamination; Failure analysis; Integrated circuit packaging; Materials testing; Moisture; Performance evaluation; Predictive models; Qualifications; Thermal expansion; Thermomechanical processes;
Conference_Titel :
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Print_ISBN :
0-7803-8420-2
DOI :
10.1109/ESIME.2004.1304035
