Title :
An embedded transmission line micro-ball grid array X-band power amplifier
Author :
Budka, T. ; Stiborek, L. ; Heinrich, L. ; Kyhl, C.
Author_Institution :
R&D, M/A-COM Corp., Lowell, MA, USA
Abstract :
This paper describes an electronic packaging topology using embedded transmission line (ETL) monolithic microwave integrated circuits (MMIC) that have been flip-chip mounted on a beryllia (BeO) micro-ball grid array (/spl mu/BGA) ceramic carrier with a z-axis interconnect material. Small signal S-parameters are presented at each stage during the assembly process and negligible frequency shifts are observed due to the flip-chip packaging before and after encapsulation. Increased gains of 2.0 dB with the unencapsulated and 2.2 dB with the encapsulated packaged part are observed compared to the on-wafer measurements at 10 GHz under the same bias conditions.
Keywords :
MMIC power amplifiers; S-parameters; flip-chip devices; integrated circuit packaging; 10 GHz; BeO; BeO ceramic carrier; MMIC; X-band; ball grid array; electronic packaging topology; embedded transmission line micro-BGA; flip-chip mounting; monolithic microwave integrated circuits; power amplifier; small signal S-parameters; z-axis interconnect material; Ceramics; Circuit topology; Distributed parameter circuits; Electronics packaging; Integrated circuit interconnections; MMICs; Microwave antenna arrays; Microwave integrated circuits; Monolithic integrated circuits; Power transmission lines;
Conference_Titel :
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-4471-5
DOI :
10.1109/MWSYM.1998.700611
