DocumentCode
3055540
Title
Parameter calibration on post-ion-implantation dopant diffusions
Author
Fu, J. ; Crans, W. ; Eysenga, W.J.
Author_Institution
X-FAB Semicond. foundries AG, Erfurt, Germany
fYear
2004
fDate
2004
Firstpage
191
Lastpage
198
Abstract
Model parameters used to describe post-implant arsenic and boron diffusions were selected with care and calibrated by using the inverse modeling optimizer "PROFILE". The parameter calibrations performed were based on the best fitting of numerical process simulation to the corresponding experimental SIMS (secondary ion mass spectrometry) measurement data. In this case, grouped model parameters were calibrated in cascade, resulting in good reproduction of dopant depth profiles. On the basis of the extracted parameters, together with the corresponding uncertainties for calibration, the dopant diffusion kinetics and mechanisms were analyzed and discussed.
Keywords
arsenic; boron; calibration; diffusion; doping profiles; ion implantation; secondary ion mass spectroscopy; semiconductor process modelling; As; B; calibration uncertainties; diffusion parameter calibration; dopant depth profiles; dopant diffusion kinetics mechanisms; experimental SIMS measurements; inverse modeling optimization; numerical process simulation; post-ion-implantation dopant diffusions; secondary ion mass spectrometry; Annealing; Application specific integrated circuits; Calibration; Circuit simulation; Inverse problems; Ion implantation; Mass spectroscopy; Predictive models; Semiconductor process modeling; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Print_ISBN
0-7803-8420-2
Type
conf
DOI
10.1109/ESIME.2004.1304040
Filename
1304040
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