Packaging of Single-Component Fractional Order Element

Author

Mondal, Debasish ; BISWAS, KAMANASHIS

Author_Institution

Dept. of Electr. Eng., Indian Inst. of Technol. Kharagpur, Kharagpur, India

Volume

13

Issue

1

fYear

2013

fDate

Mar-13

Firstpage

73

Lastpage

80

Abstract

In this paper, packaging issue of a single-component fractional order element (FOE) is presented. Packaging is required for better longevity and miniaturization of dimensions. In addition, it helps in fabrication of a single-component FOE as a discrete element similar to the existing passive circuit elements. An alternate electrode (platinized silicon) for fabricating single-component FOE other than the existing copper electrode has been proposed for the first time in this paper. A comparative analysis has been carried out between the performances of packaged FOEs using copper and platinized silicon electrodes.

Keywords

copper; electrodes; electronics packaging; silicon; copper; discrete element; platinized silicon electrode; single-component fractional order element packaging; Copper; Electrodes; Fabrication; Impedance; Packaging; Powders; Silicon; Agarose powder; fractional order element (FOE); platinized silicon; porous film;

fLanguage

English

Journal_Title

Device and Materials Reliability, IEEE Transactions on

Publisher

ieee

ISSN

1530-4388

Type

jour

DOI

10.1109/TDMR.2012.2212020

Filename

6262466