Three-dimensional stress analysis of ink marking process [electronic packaging applications]

Author

Yeh, Chang-Lin ; Lai, Yi-Shao ; Lin, Yi-Hsien ; Yang, Jung-Shian

Author_Institution

Stress-Reliability Lab., Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan

fYear

2004

fDate

2004

Firstpage

317

Lastpage

321

Abstract

In this paper, a 3D finite element model was built up to simulate the ink marking process. Due to large deformation and strains arisen during the process, the Mooney-Rivlin hyperelastic constitutive model with parameters characterized through a compression test was employed to model the mechanical response of the rubber inker. A parametric study focused on the effect of the curvature of the inking surface was carried out. Results from this study would be conducive to the optimization of the ink marking process.

Keywords

compressive testing; deformation; elasticity; electronics packaging; finite element analysis; printing; rubber products; stress analysis; 3D finite element model; 3D stress analysis; Mooney-Rivlin hyperelastic constitutive model; compression testing; electronic package company brand marking; ink marking process optimization; inking surface curvature effects; package information marking; process deformation; process strains; rubber inker mechanical response; Capacitive sensors; Deformable models; Electronics packaging; Finite element methods; Ink; Lagrangian functions; Parametric study; Potential energy; Rubber; Tensile stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on

Print_ISBN

0-7803-8420-2

Type

conf

DOI

10.1109/ESIME.2004.1304057

Filename

1304057