Title :
Three-dimensional stress analysis of ink marking process [electronic packaging applications]
Author :
Yeh, Chang-Lin ; Lai, Yi-Shao ; Lin, Yi-Hsien ; Yang, Jung-Shian
Author_Institution :
Stress-Reliability Lab., Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan
Abstract :
In this paper, a 3D finite element model was built up to simulate the ink marking process. Due to large deformation and strains arisen during the process, the Mooney-Rivlin hyperelastic constitutive model with parameters characterized through a compression test was employed to model the mechanical response of the rubber inker. A parametric study focused on the effect of the curvature of the inking surface was carried out. Results from this study would be conducive to the optimization of the ink marking process.
Keywords :
compressive testing; deformation; elasticity; electronics packaging; finite element analysis; printing; rubber products; stress analysis; 3D finite element model; 3D stress analysis; Mooney-Rivlin hyperelastic constitutive model; compression testing; electronic package company brand marking; ink marking process optimization; inking surface curvature effects; package information marking; process deformation; process strains; rubber inker mechanical response; Capacitive sensors; Deformable models; Electronics packaging; Finite element methods; Ink; Lagrangian functions; Parametric study; Potential energy; Rubber; Tensile stress;
Conference_Titel :
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Print_ISBN :
0-7803-8420-2
DOI :
10.1109/ESIME.2004.1304057
