Title :
Analysis of thermal-moisture induced failure of Pb-free soldered IC packages in SMT reflow soldering process
Author :
Sun, Ning ; Lin, Dachuan ; Yang, Daoguo
Author_Institution :
Guilin Univ. of Electron. Technol., China
Abstract :
In this paper, firstly, a moisture absorption and diffusion model is applied to obtain an accurate moisture diffusion field during moisture preconditioning and reflow processes. Secondly, based on the transient moisture distribution, a developed inner vapor model is used to get the vapor pressure, which depends on the position, temperature and moisture. Finally, tensile tests were performed for the package material, with temperatures up to 250°C. A fracture mechanics method was used to study the crack propagation behavior under the combinational effect of the stresses. An evaluation was made based on the simulation results and the experimental results.
Keywords :
failure analysis; fracture mechanics; integrated circuit packaging; integrated circuit reliability; moisture; plastic packaging; reflow soldering; surface mount technology; tensile testing; thermal stress cracking; vapour pressure; 250 degC; Pb-free soldered IC packages; SMT reflow soldering process; combinational stress effects; crack propagation; fracture mechanics; inner vapor model; moisture absorption model; moisture diffusion field; moisture preconditioning; plastic-encapsulation; tensile tests; thermal-moisture induced failure; transient moisture distribution; vapor pressure; Absorption; Failure analysis; Integrated circuit packaging; Materials testing; Moisture; Reflow soldering; Semiconductor device modeling; Surface-mount technology; Temperature dependence; Temperature distribution;
Conference_Titel :
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Print_ISBN :
0-7803-8420-2
DOI :
10.1109/ESIME.2004.1304061
