• DocumentCode
    3056163
  • Title

    Hardware description language modeling of an electrostatically actuated bi-axial micromirror

  • Author

    Parrain, Fabien ; Megherbi, Souhil ; Raynaud, Gilles ; Mathias, Hervé ; Gilles, Jean-Paul ; Bosseboeuf, Alain ; Schropfer, Gerold ; Faure, Nicolas ; Cusin, Pierre

  • Author_Institution
    Inst. d´´Electron. Fondamentale, Univ. de Paris-Sud, Orsay, France
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    393
  • Lastpage
    397
  • Abstract
    Recent developments in micro-electro-mechanical system (MEMS) and micromachining technologies have made possible the development and the integration of micromirrors that can be employed for a number of consumer applications, such as free space optical switching, 2D scanning, or image projection. This high level of integration provides many advantages such as reproductivity and improved performance. Obviously, these increased levels of miniaturization raise new characterization and modeling concerns. We present in this paper the design, the fabrication process, the characterization and the behavioral modeling approach of a novel electrostatically actuated bi-axial micromirror. This MOEMS is a result of a joint development between our partners Colibrys and Coventor companies. In the field of this work, two HDL multi-physics models using Verilog-A language and Matlab have been developed and validated by different experimental measurements.
  • Keywords
    electrostatic actuators; hardware description languages; micromirrors; 2D scanning; HDL multiphysics models; MEMS; MOEMS; electrostatically actuated bi-axial micromirror; free space optical switching; hardware description language modeling; image projection; micromachining technologies; Hardware design languages; Integrated optics; Mathematical model; Microelectromechanical systems; Micromachining; Micromechanical devices; Micromirrors; Optical device fabrication; Process design; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
  • Print_ISBN
    0-7803-8420-2
  • Type

    conf

  • DOI
    10.1109/ESIME.2004.1304069
  • Filename
    1304069