Title :
Modeling stress strain curves for lead-free 95.5Sn-3.8Ag-0.7Cu solder
Author :
Pang, John H L ; Xiong, B.S. ; Che, F.X.
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore
Abstract :
Mechanics of materials characterization of lead-free solder mechanical properties and stress strain curve properties are needed for applications in finite element analysis. In this study, tensile properties for lead-free 95.5Sn-3.8Ag-0.7Cu solder alloy were obtained from bulk tensile specimen tests. A modified Ramberg-Osgood model was developed to describe the temperature and strain rate dependent stress-strain curves for the solder alloys. The modified Ramberg-Osgood model is able to predict the temperature and strain rate effects on the stress-strain properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy. Comparison between the proposed modified Ramberg-Osgood model and the Anand viscoplastic model is made in predicting the stress-strain data obtained from the constant strain rate tensile tests.
Keywords :
copper alloys; environmental factors; finite element analysis; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; silver alloys; solders; stress-strain relations; tensile strength; tensile testing; tin alloys; Anand viscoplastic model; SnAgCu; bulk tensile specimen tests; constant strain rate tensile tests; finite element analysis; lead-free Sn-Ag-Cu solder; lead-free solder mechanical properties; materials characterization mechanics; modified Ramberg-Osgood model; solder alloys; strain rate dependent stress-strain curves; stress strain curve modeling; stress-strain data; temperature dependent stress-strain curves; tensile properties; Capacitive sensors; Environmentally friendly manufacturing techniques; Finite element methods; Lead; Mechanical factors; Predictive models; Temperature dependence; Tensile strain; Tensile stress; Testing;
Conference_Titel :
Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the 5th International Conference on
Print_ISBN :
0-7803-8420-2
DOI :
10.1109/ESIME.2004.1304077
