DocumentCode
3057109
Title
Mechanical characterisation of a polysilicon accelerometer
Author
Burdess, J.S. ; Harris, A.J. ; Pitcher, R. ; Ward, M. ; King, D. ; Wood, D.
Author_Institution
Newcastle Univ., NSW, Australia
fYear
1996
fDate
35401
Firstpage
42552
Lastpage
42558
Abstract
This paper describes a measurement system which has been developed to determine, experimentally, the dynamic characteristics of microstructures. These characteristics include dynamic mode shape of free vibration, natural frequencies and modal damping factors. The system is demonstrated by determining the dynamic characteristics of a polysilicon accelerometer designed and produced at DRA Malvern. The accelerometer takes the form of a 2 μm thick polysilicon plate supported at as corners by beam like ligaments. Acceleration causes bending defections of the plate against the elasticity of the ligaments and this is taken as a measure of acceleration. The mechanical design of the sensor was carried using finite element analysis (ANSYS). In the experimental evaluation of the dynamics of the accelerometer the sensor was mounted within a general purpose piezoelectric staging and excited into vibration by applying a swept sine excitation to the piezoelectric. Using a laser vibrometer the notion of an array of selected test points on the accelerometer was measured and point frequency response functions calculated over a frequency range of 0 to 100 kHz. Using this data the dynamic mode shapes, natural frequencies and modal damping factors were calculated and the experimental behaviour of the sensor observed by animating a wire framed drawing of the structure. The mechanical damping of the accelerometer is determined by the behaviour of the squeeze film between the plate and the supporting substrate
Keywords
accelerometers; 1 mum; 1 to 100 kHz; 2 mum; ANSYS; Si; bending defections; damping factors; dynamic characteristics; dynamic mode shape; dynamic mode shapes; elasticity; finite element analysis; free vibration; frequency response; laser vibrometer; ligaments; mechanical design; microstructures; modal damping factors; natural frequencies; piezoelectric staging; polysilicon accelerometer; sealed cavity; squeeze film; swept sine excitation; wire framed drawing;
fLanguage
English
Publisher
iet
Conference_Titel
Silicon Fabricated Inertial Instruments (Digest No: 1996/227), IEE Colloquium on
Conference_Location
London
Type
conf
DOI
10.1049/ic:19961219
Filename
641903
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