• DocumentCode
    3057267
  • Title

    Investigation of breakdown behavior for AlGaN HEMTs

  • Author

    Huebschman, Benjamin D. ; Darwish, Ali ; Goldsman, Neil ; Vivieros, Edward A. ; Hung, Alfred

  • Author_Institution
    Sensor & Electron Devices Div., Army Res. Lab., MD, USA
  • fYear
    2009
  • fDate
    9-11 Dec. 2009
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    The ability to accurately determine the breakdown voltage of microwave transistors is critical to the design of high power microwave amplifiers. The optimal bias point and output impedance should be selected to ensure that the load line of the device during peak output power does not intersect the portion of the IV curve where the device breaks down. This paper presents a technique to determine a drain-source breakdown voltage measurement that is useful for the design of high power microwave amplifiers. This measurement has been performed on GaN HEMTs from several different domestic foundries. Using the results of this experiment, an optimal bias point that makes use of the entire load line while at the same time avoiding the destructive effects of breakdown, can be selected.
  • Keywords
    III-V semiconductors; aluminium compounds; electric variables measurement; high electron mobility transistors; semiconductor device breakdown; semiconductor device measurement; wide band gap semiconductors; AlGaN; HEMT; breakdown behavior; domestic foundries; drain-source breakdown voltage measurement; high electron mobility transistor; high power microwave amplifiers; optimal bias point; Aluminum gallium nitride; Electric breakdown; HEMTs; High power amplifiers; Impedance; MODFETs; Microwave amplifiers; Microwave devices; Microwave transistors; Power generation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium, 2009. ISDRS '09. International
  • Conference_Location
    College Park, MD
  • Print_ISBN
    978-1-4244-6030-4
  • Electronic_ISBN
    978-1-4244-6031-1
  • Type

    conf

  • DOI
    10.1109/ISDRS.2009.5378161
  • Filename
    5378161