Title :
Fatigue behavior and effect of crack propagation in lead free solder in microelectronic packaging
Author :
Paradee, Gary ; Christou, Aris
Author_Institution :
Dept. of Mater. Sci. & Eng., Univ. of Maryland, College Park, MD, USA
Abstract :
We have observed stress softening behavior of SAC 305 bulk solder bars tested at various stress levels and frequencies at room temperature. The behavior can be described by crack propagation through these as well as microstructural interactions within the material. Continued testing at other stress levels and temperatures will be conducted to further understand low cycle fatigue in SAC 305 to eventually improve the reliability of devices using SAC 305.
Keywords :
cracks; integrated circuit packaging; solders; SAC 305 bulk solder bars; crack propagation; lead free solder; microelectronic packaging; stress softening; Bars; Environmentally friendly manufacturing techniques; Fatigue; Lead; Microelectronics; Packaging; Softening; Stress; Temperature; Testing;
Conference_Titel :
Semiconductor Device Research Symposium, 2009. ISDRS '09. International
Conference_Location :
College Park, MD
Print_ISBN :
978-1-4244-6030-4
Electronic_ISBN :
978-1-4244-6031-1
DOI :
10.1109/ISDRS.2009.5378270
