• DocumentCode
    3060040
  • Title

    Modeling Protein-Based 3-D Memory in SPICE

  • Author

    Brower, Ronald W. ; Ewing, Robert L. ; Brower, Andrew J.

  • Author_Institution
    Air Force Res. Lab., Wright Patterson Air Force Base, OH
  • fYear
    2008
  • fDate
    16-18 July 2008
  • Firstpage
    385
  • Lastpage
    389
  • Abstract
    The Simulation Program For Integrated Circuit Engineering (SPICE) has been used successfully for many years to aid semiconductor circuit design. SPICE represents circuits as networks of basic devices with interacting parameters (current, voltage, etc.), and then models these interactions as systems of partial differential equations. Biological systems are roughly similar, consisting of networks of interacting biochemical cycles whose resulting chemical concentrations can also be modeled by partial differential equations. In the present work, we use SPICE to model an optically-accessed, protein-based, 3-D memory. Modeling the protein´s photochemical effects in SPICE allows us to include, within the same model, the supporting electronics and optics needed to properly cycle the memory and interface it to the outside world.
  • Keywords
    biochemistry; integrated circuit design; molecular biophysics; partial differential equations; photochemistry; proteins; SPICE; Simulation Program For Integrated Circuit Engineering; biochemical cycles; biological systems; partial differential equations; photochemical effect; protein based 3D memory model; semiconductor circuit design; Biological system modeling; Biological systems; Biomedical optical imaging; Circuit synthesis; Design engineering; Integrated circuit modeling; Partial differential equations; Protein engineering; SPICE; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace and Electronics Conference, 2008. NAECON 2008. IEEE National
  • Conference_Location
    Dayton, OH
  • ISSN
    7964-0977
  • Print_ISBN
    978-1-4244-2615-7
  • Electronic_ISBN
    7964-0977
  • Type

    conf

  • DOI
    10.1109/NAECON.2008.4806577
  • Filename
    4806577