Title :
A Fully Integrated High Efficiency RF Power Amplifier for WLAN Application in 40 nm Standard CMOS Process
Author :
Namsik Ryu ; Bonghyuk Park ; Yongchae Jeong
Author_Institution :
Electron. & Telecommun. Res. Inst. (ETRI), Daejeon, South Korea
Abstract :
This paper proposes a CMOS linear power amplifier (PA) design scheme for IEEE 802.11g (WLAN) application. The proposed PA consists of a programmable gain amplifier and a high power stage which is composed of a main amplifier with class AB bias and an auxiliary amplifier with class C bias. Based on the un-even bias scheme, the power stage can improve linearity and reduce current consumption in the low power region. It is fabricated with a TSMC 40 nm standard RF CMOS process. The measurements show that the designed PA reaches a 1 dB gain compression output power of 24.6 dBm and a peak drain efficiency of 38% with a 3.3 V power supply at 2.4 GHz operating frequency range. When the PA was tested with an IEEE 802.11g OFDM signal of 20 MHz channel bandwidth, the obtained -25 dB EVM compliant output power and drain efficiency are 18.5 dBm and 14%, respectively.
Keywords :
CMOS analogue integrated circuits; UHF integrated circuits; UHF power amplifiers; integrated circuit testing; CMOS linear power amplifier design scheme; IEEE 802.11g OFDM signal; IEEE 802.11g application; PA design scheme; TSMC standard RF CMOS process; WLAN application; auxiliary amplifier; class AB bias; class C bias; current consumption; efficiency 14 percent; efficiency 38 percent; frequency 2.4 GHz; frequency 20 MHz; fully integrated high efficiency RF power amplifier; gain -25 dB; gain 1 dB; peak drain efficiency; programmable gain amplifier; size 40 nm; uneven bias scheme; voltage 3.3 V; CMOS integrated circuits; IEEE 802.11g Standard; Logic gates; Power generation; Radio frequency; Transistors; Wireless LAN; CMOS power amplifier; OFDM; WLAN; efficiency enhancement; high efficiency; linear power amplifier; linearization;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2015.2421351