DocumentCode
3061924
Title
Thermal microactuators for optical purpose
Author
Huja, Martin ; Husak, Miroslav
Author_Institution
Dept. of Microelectron., Czech Tech. Univ., Prague, Czech Republic
fYear
2001
fDate
36982
Firstpage
137
Lastpage
142
Abstract
The core of the project was to design a moveable micromirror array with the most optimal dependence of the optically active area, the deflection angles and the micromirror power consumption. The matrix of 10×20 micromirrors uses a thermal actuated principle. The micromirror was designed using an industrial 0.8 μm double metal CMOS process followed by one single postprocessing step and anisotropic silicon etch. The device consists of one cantilever beam supporting the mirror plate. The beam is a bimorph sandwich of aluminium and silicon dioxide enclosing polysilicon heating resistor. The control electronics contains 20-bit edge-triggered shift register with serial data entry and an output from each of the twenty stages (flip-flop). The output buffer is a driver for the CMOS switch (transfergate) which connects current (Pad Supply for the beam) to the thermal actuator (beam). The ANSYS program was used for the mechanical simulation of thermally actuated micromirror
Keywords
CMOS integrated circuits; etching; micro-optics; microactuators; mirrors; 0.8 micron; ANSYS program; Al-SiO2-Si; anisotropic silicon etch; bimorph sandwich; cantilever beam; control electronics; deflection angles; double metal CMOS process; edge-triggered shift register; mechanical simulation; mirror plate; moveable micromirror array; optically active area; output buffer; polysilicon heating resistor; postprocessing step; power consumption; thermal microactuators; CMOS process; Energy consumption; Geometrical optics; Metals industry; Microactuators; Micromirrors; Optical arrays; Optical buffering; Optical design; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Information Technology: Coding and Computing, 2001. Proceedings. International Conference on
Conference_Location
Las Vegas, NV
Print_ISBN
0-7695-1062-0
Type
conf
DOI
10.1109/ITCC.2001.918779
Filename
918779
Link To Document