DocumentCode
3062543
Title
IC manufacturing options to break the cost/performance bottleneck
Author
Case, Christopher
Author_Institution
Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA
fYear
1998
fDate
1998
Firstpage
35
Abstract
Summary form only given, as follows. With the IC industry projected to grow to $273 billion by the year 2000 and worldwide electronic production to $1 trillion in the same period, the author discusses the macroeconomics and demographic trends that will sustain this growth. Applications, opportunity drivers and production are all discussed, by region. The Semiconductor Industry Association´s National Technology Roadmap for Semiconductor forecasts 1 GHz 14 cm2 chips by the year 2010; part of burden in meeting the cost/performance challenges to keep the industry on this roadmap falls on the IC back-end interconnection. The increased complexity supporting enhanced performance of the these IC´s comes from additional wiring levels, greater interconnect density and the total interconnect length. The author explores these complexity issues and the economic trade-off between performance and functionality
Keywords
electronics industry; integrated circuit economics; production; IC back-end interconnection; IC industry; IC manufacturing; cost/performance bottleneck; demographic trends; economic tradeoff; interconnect density; macroeconomics; production; technology roadmap; total interconnect length; Costs; Demography; Driver circuits; Electronics industry; Industrial electronics; Macroeconomics; Manufacturing industries; Production; Technology forecasting; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.785778
Filename
785778
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