• DocumentCode
    3062543
  • Title

    IC manufacturing options to break the cost/performance bottleneck

  • Author

    Case, Christopher

  • Author_Institution
    Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    35
  • Abstract
    Summary form only given, as follows. With the IC industry projected to grow to $273 billion by the year 2000 and worldwide electronic production to $1 trillion in the same period, the author discusses the macroeconomics and demographic trends that will sustain this growth. Applications, opportunity drivers and production are all discussed, by region. The Semiconductor Industry Association´s National Technology Roadmap for Semiconductor forecasts 1 GHz 14 cm2 chips by the year 2010; part of burden in meeting the cost/performance challenges to keep the industry on this roadmap falls on the IC back-end interconnection. The increased complexity supporting enhanced performance of the these IC´s comes from additional wiring levels, greater interconnect density and the total interconnect length. The author explores these complexity issues and the economic trade-off between performance and functionality
  • Keywords
    electronics industry; integrated circuit economics; production; IC back-end interconnection; IC industry; IC manufacturing; cost/performance bottleneck; demographic trends; economic tradeoff; interconnect density; macroeconomics; production; technology roadmap; total interconnect length; Costs; Demography; Driver circuits; Electronics industry; Industrial electronics; Macroeconomics; Manufacturing industries; Production; Technology forecasting; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    0-7803-4306-9
  • Type

    conf

  • DOI
    10.1109/ICSICT.1998.785778
  • Filename
    785778