• DocumentCode
    3062721
  • Title

    Manufacturing process of bipolar IC with Zener diode

  • Author

    Wang, Jianfeng ; Cao, Jian ; Shen, Yongming ; Jiang, Yuefang

  • Author_Institution
    Inst. of Metall., Acad. Sinica, Shanghai, China
  • fYear
    1998
  • fDate
    1998
  • Firstpage
    71
  • Lastpage
    73
  • Abstract
    This paper describes a manufacturing process of a bipolar IC with a Zener diode. The Zener diode is manufactured by a process which is compatible with the ordinary bipolar IC process. Since the breakdown voltage of the Zener diode is not equal to the emitter-base breakdown voltage of the longitudinal n-p-n transistors, the doping concentration in the positive area of the Zener diode is not the same as the doping concentration in the base area of the n-p-n transistor. The doping concentration and junction depth of the positive of the Zener diode is decided by its breakdown voltage value. It is produced by another implantation dose and followed by a drive-in step. Hence this process utilizes two boron implantations during the base area formation, one is used to form the base area of ordinary n-p-n transistors, another is used to make the positive of the Zener diode. The relationship between the implantation dose and breakdown voltage of the Zener diode is investigated. A bipolar ASIC with a Zener diode was fabricated by this process
  • Keywords
    Zener diodes; Zener effect; application specific integrated circuits; bipolar integrated circuits; boron; integrated circuit manufacture; ion implantation; semiconductor device breakdown; B implantations; Si:B; Zener breakdown voltage; Zener diode; bipolar ASIC; bipolar IC fabrication; doping concentration; emitter-base breakdown voltage; implantation dose; junction depth; manufacturing process; n-p-n transistors; Application specific integrated circuits; Bipolar integrated circuits; Boron; Diodes; Doping; Epitaxial layers; Manufacturing processes; Metallization; Silicon; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    0-7803-4306-9
  • Type

    conf

  • DOI
    10.1109/ICSICT.1998.785795
  • Filename
    785795