DocumentCode :
3063261
Title :
Flip-chip mounted silicon-based Impatt diodes for automotive applications
Author :
Wollitzer, M. ; Strohm, K.M. ; Jorke, H. ; Luy, J.-F. ; Rasshofer, R.H. ; Biebl, E.M.
Author_Institution :
Res. Center, Daimler-Benz AG, Ulm, Germany
Volume :
3
fYear :
1998
fDate :
7-12 June 1998
Firstpage :
1699
Abstract :
We present the first silicon-based active antenna based on flip-chip mounted Impatt diodes. Our results show that flip-chip integration of Impatt diodes is a very promising alternative to monolithic integration since expected output power and heat removal is improved significantly. Compared to active antennas based on monolithic integration, the chip size of the novel flip-chip device is reduced by a factor of 50. Due to this fact, considerable reduction of manufacturing costs is expected.
Keywords :
IMPATT diodes; active antennas; automotive electronics; elemental semiconductors; flip-chip devices; millimetre wave antennas; mobile antennas; silicon; Si; active antenna; automotive application; flip-chip integration; heat removal; manufacturing cost; output power; silicon IMPATT diode; Automotive applications; Automotive engineering; Contacts; Diodes; Fingers; Gold; Monolithic integrated circuits; Power generation; Silicon; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location :
Baltimore, MD, USA
ISSN :
0149-645X
Print_ISBN :
0-7803-4471-5
Type :
conf
DOI :
10.1109/MWSYM.1998.700707
Filename :
700707
Link To Document :
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