An advanced hybrid assembly technique for 40 Gbit/s-modules including surface and feed-through capacitors

Author

Hanke, G. ; Nohr, W. ; Weber, D.

Author_Institution

Deutsche Telecom AG, Darmstadt, Germany

Volume

3

fYear

1998

fDate

7-12 June 1998

Firstpage

1703

Abstract

Experimental 40 Gbit/s ETDM transmitter and receiver modules for optical fiberlink applications were developed. To obtain the essential extreme broad bandwidth the GaAs-chips are connected by self-supporting leads to ceramic thin film circuits which shows nearly reflection- and discontinuity-free connections up to millimeter-wave frequencies. In addition the use of hybrid integrated surface and coaxial feed-through capacitors results in low impedances and ultra broadband bypasses.

Keywords

III-V semiconductors; capacitors; gallium arsenide; hybrid integrated circuits; microassembling; millimetre wave integrated circuits; optical fibre communication; optical receivers; optical transmitters; time division multiplexing; 40 Gbit/s; ETDM; GaAs; GaAs chip; ceramic thin film circuit; coaxial feed-through capacitor; hybrid assembly; millimeter-wave frequency; optical fiber link; receiver module; self-supporting lead; surface capacitor; transmitter module; Assembly; Bandwidth; Ceramics; Millimeter wave integrated circuits; Optical fibers; Optical films; Optical receivers; Optical transmitters; Thin film circuits; Ultraviolet sources;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1998 IEEE MTT-S International

Conference_Location

Baltimore, MD, USA

ISSN

0149-645X

Print_ISBN

0-7803-4471-5

Type

conf

DOI

10.1109/MWSYM.1998.700708

Filename

700708