DocumentCode
3063499
Title
Wire bonding technique for high temperature applications
Author
Freytag, Jürgen ; Wennemuth, Ingo
Author_Institution
Res. & Technol., Daimler-Benz AG, Frankfurt, Germany
fYear
1998
fDate
1998
Firstpage
219
Lastpage
221
Abstract
Palladium (Pd) wire is a favourable metal for wire bonding electronic devices operating an enhanced temperatures. The bonding process was investigated and the significant process parameters were identified. Different parameter sets were worked out for various bonding machines. The separation of the wire after the bonding process was found to be decisive for the quality of the bond. Thermal ageing at enhanced temperatures (i.e. 300°C for 1000 h) causes no degradation of the bonds
Keywords
adhesion; ageing; high-temperature effects; lead bonding; metallisation; palladium; 1000 h; 300 C; Pd wire; Pd-Si; Si; bonds; high temperature applications; metal; palladium wire; process parameters; thermal ageing; wire bonding technique; Aging; Artificial intelligence; Atmosphere; Bonding forces; Bonding processes; Furnaces; Gold; Materials reliability; Temperature; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.785858
Filename
785858
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