Title :
Joule heating effect on evaluation of lifetime in electromigration experiment
Author :
Sun, Yinghua ; Li, Zhi Guo ; Cheng, Yiao Hai ; Yuan, Ji
Author_Institution :
Dept. of Electron. Eng., Beijing Polytech. Univ., China
Abstract :
In this paper Joule heating effect of metallization in different widths and materials has been tested under varied current density stresses according to the relation of resistance and temperature of metal stripes. The high density current in the metal stripes created the great temperature increase due to Joule heating effect. It seriously affected evaluation of MTF and accuracy of current density exponent value in the metallization electromigration experiment. The MTF values have been corrected on the basis of the real temperature of stripes, and the corrected exponent n has been obtained
Keywords :
current density; electromigration; integrated circuit metallisation; life testing; Joule heating effect; corrected exponent; current density exponent; current density stresses; electromigration; high density current; lifetime; metal stripes; metallization; metallization electromigration; resistance; temperature increase; Conductivity; Current density; Electromigration; Equations; Inorganic materials; Metallization; Resistance heating; Stress; System testing; Temperature dependence;
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-4306-9
DOI :
10.1109/ICSICT.1998.785861
