DocumentCode
3064054
Title
Sampling methodology for SEM-based defect classification: risk, cost, and benefit analysis
Author
Akella, Ram ; Lin, Chih-Hung ; Chitturi, Prasanna
Author_Institution
Stanford Univ., CA, USA
fYear
1998
fDate
1998
Firstpage
319
Lastpage
323
Abstract
The current paper analyzes the relative merits of optical and SEM-based defect classification systems, the needs and costs associated with these systems, and the factors limiting the usability of these systems. In particular, we consider the impact of throughput rate and classification accuracy, on excursion detection and the resulting economic benefits. The paper includes a discussion of these models and a comparison is made to obtain the maximum benefits from existing optical and SEM review and classification methodologies. Scenarios for 0.25 micron fabs are used to indicate the procedures and policies that are the most effective from a fab economic perspective
Keywords
cost-benefit analysis; flaw detection; inspection; integrated circuit economics; integrated circuit modelling; integrated circuit yield; process monitoring; sampling methods; scanning electron microscopy; statistical process control; 0.25 micron; SEM-based defect classification; automated process; classification accuracy; classification methodology; economic benefits; excursion detection; in-line monitoring; optical-based defect classification; review methodology; risk/cost/benefit analysis; sampling methodology; semiconductor manufacturing; throughput rate; yield management; Cost benefit analysis; Inspection; Optical materials; Risk analysis; Sampling methods; Semiconductor device manufacture; Semiconductor device modeling; Technology management; Throughput; Usability;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.785885
Filename
785885
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