DocumentCode
3065175
Title
Microstructure and fatigue resistance of solder interfaces
Author
Ku Shang, Jian ; Yao, Daping ; Zhang, Chuosheng
Author_Institution
Dept. of Mater. Sci. & Eng., Illinois Univ., Urbana, IL, USA
fYear
1998
fDate
1998
Firstpage
541
Abstract
Summary form only given. The relationship between microstructure and fatigue resistance of solder interfaces was studied by examining micromechanisms and micromechanics of fatigue crack growth along a series of model interfaces. While the fatigue crack was seen to prefer staying in the solder when propagating at high rates, interfacial crack sliding was predominant in the near-threshold regime. A micromechanical model of interfacial crack sliding was developed, based on the interface fracture mechanics concept
Keywords
ageing; fatigue cracks; interface phenomena; interface structure; soldering; fatigue crack growth; fatigue resistance; interface fracture mechanics; interfacial crack sliding; micromechanical model; micromechanics; model interfaces; near-threshold regime; solder interfaces; Cooling; Copper; Fatigue; Geometry; Microstructure; Predictive models; Semiconductor device modeling; Sliding mode control; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1998. Proceedings. 1998 5th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-4306-9
Type
conf
DOI
10.1109/ICSICT.1998.785942
Filename
785942
Link To Document